A 17-GHz 130-nm CMOS VCO Subsystem Module in LTCC-Based Technology for WLAN Applications

Pierre Mayr, S. Mecking, S. Walter, R. Matz, Ulrich Langmann

International Journal of RF and Microwave Computer-Aided Engineering, Vol. 16, No 3, pp. 218-226


This article presents a 17-GHz band VCO for system-in-a-package (SiP) solutions. A workflow for a chip-package codesign, which includes the design of LTCC-inductors, is presented. The VCO shows a phase noise of 110 dBc/Hz at 1-MHz offset and a figure of merit (FOM) of 190.4 dBc/Hz. Design trade-offs are given concerning phase noise, tuning range, and power consumption. © 2006 Wiley Periodicals, Inc. Int J RF and Microwave CAE 16: 218–226, 2006.