Publications

Channel Equalization in HSDPA Receivers: Trade-Off between Performance and Complexity with a variable Oversampling

2006 - M. Schämann, M. Bücker, Sebastian Hessel, Ulrich Langmann

VTC 2006 Spring, Melbourne, Australia, May 2006

A 17-GHz 130-nm CMOS VCO Subsystem Module in LTCC-Based Technology for WLAN Applications

2006 - Pierre Mayr, S. Mecking, S. Walter, R. Matz, Ulrich Langmann

International Journal of RF and Microwave Computer-Aided Engineering, Vol. 16, No 3, pp. 218-226

Measuring of Low Contact Resitivities of CoSi2 on Shallow B-Junctions

2005 - Hans-Ulrich Schreiber †, M. Wiemann

IEEE Transactions on Electron. Devices, Vol. 52 (2005), No 10, pp. 2336-2339,

Keramische System-in-Package-Technologie für 5-GHz-WLAN-Transceiver

2005 - R. Matz, W. Bakalski, W. Debski, Ulrich Langmann, Pierre Mayr, W. Simbürger, S. Walter, P. Weger, Christopher Weyers

Deutsche IMAPS-Konferenz, München, 10.-11. Oktober 2005

Ein pseudofraktionaler Synthesegenerator mit filterbaren spektralen Störlinien und gutem Phasenrauschen

2005 - Thomas Musch, Nils Pohl, Burkhard Schiek †

Kleinheubacher Tagung 2005, U.R.S.I. Landesausschuss in der Bundesrepublik Deutschland e.V., Miltenberg, Sept. 2005

Edge Position Modulation for Wireless Infrared Communications Based on Novel 1/3 Rate RLL(5,12) Code

2005 - T. Lüftner, M. Huemer, R. Hagelauer, R. Weigel, Josef Hausner

Proceedings of the 9th World Multi-Conference on Systemics, Cybernetics and Informatics (WMSCI’ 2005), pp. 38-42 (Proc. Vol. VIII), Orlando, USA, July 2005

Entwurf eines HSDPA-Mobilfunkempfängers: Algorithmen, Verlustleistungsschätzung und Partitionierung

2005 - M. Schämann, Ulrich Langmann

LEMOS-Workshop im Rahmen des Ekompass-Workshops, Hannover, April 2005

A 10-Gb/s CMOS Clock and Data Recovery Circuit with an Analog Phase Interpolator

2005 - R .Kreienkamp, Ulrich Langmann, Ch. Zimmermann, T. Aoyama, H. Siedhoff

IEEE Journal of Solid-State Circuits, Vol. 40, No. 3, March 2005, pp. 736-743

Wireless RF Multi-Chip-Modules for LTCC System-in-Package Solutions: Key Design Considerations

2004 - Ulrich Langmann, Pierre Mayr, S. Mecking

Asia Pacific Microwave Conference,15-18 December 2004, New Delhi, Indien, Invited Paper

Multilayer Ceramic Band-Pass-Filters for System-in-Package 5-GHz-WLAN Transeivers

2004 - W. Debski, S. Walter, R. Matz, O. Dernovsek, S. Mecking, Pierre Mayr, P. Weger

37th International Symposium on Microelectronics (IMAPS 2004), 14-18 November 2004, Long Beach, FL
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