Publications

Wireless RF Multi-Chip-Modules for LTCC System-in-Package Solutions: Key Design Considerations

2004 - Ulrich Langmann, Pierre Mayr, S. Mecking

Asia Pacific Microwave Conference,15-18 December 2004, New Delhi, Indien, Invited Paper

Multilayer Ceramic Band-Pass-Filters for System-in-Package 5-GHz-WLAN Transeivers

2004 - W. Debski, S. Walter, R. Matz, O. Dernovsek, S. Mecking, Pierre Mayr, P. Weger

37th International Symposium on Microelectronics (IMAPS 2004), 14-18 November 2004, Long Beach, FL

Microchanneling Investigation of ?-FeSi2-Structures

2004 - D. Grambole, V. Herrmann, Hans-Ulrich Schreiber †, J. Meijer

9th International Conference on Nuclear Microprobe Technology and Applications (ICNMTA) 2004, Dubrovnik, Kroatien (13.-17.Sep 2004), BOOK OF ABSTRACTS of 9th ICNMTA, p. 04-03(2004)

Efficient Hardware Architectures of MIMO Receivers for HSDPA Applications in Frequency Selective Channels: A Comparison

2004 - M. Schämann, W. Wilhelm, D. Bierbaum, Ulrich Langmann

World Wireless Congress, 25-28 May 2004, San Francisco, CA, Conf. Proc., pp. 235-240
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