Wireless RF Multi-Chip-Modules for LTCC System-in-Package Solutions: Key Design Considerations

Ulrich Langmann, Pierre Mayr, S. Mecking

Asia Pacific Microwave Conference,15-18 December 2004, New Delhi, Indien, Invited Paper


Abstract

During the last years System-in-Package (SiP) solutions for RF-transceivers have become an attractive alternative to System-on-Chip (SoC) approaches. After a short overview of state-of-the-art SiP-technologies this paper presents system-package codesign issues, necessary to exploit the potential offered by SiP, in particular by Low Temperature Cofired Ceramics (LTCC) based SiP-techniques. Besides aspects concerning integrated circuit design, system related facets are discussed. In addition advantages and limitations compared to an SoC-approach will be compiled.

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